MB-102 830 Tie Points Breadboard Solderless Prototyping Project Board

Product details of MB-102 830 Tie Points Breadboard Solderless Prototyping Project Board
A MB-102 830 Points Solderless Breadboard is a tool for experimenting with circuit designs whether in the R&D or university lab. A breadboard is used to make up temporary circuits for testing or to try out an idea. No soldering is required so it is easy to change connections and replace components.

Parts will not be damaged so they will be available for re-use afterward. 830 Tie points  will accept transistors, diodes, LEDs, resistors, capacitors and virtually all types of components – No soldering required – Can modify or revise the circuits easily Fit for jumper wire of 0.8mm diameter – Standard 2.54mm hole spacing Adhesive sheet on the back side of the board – Multiple breadboards can be spliced together too.

Specification of MB-102 830 Tie Points Breadboard Solderless Prototyping Project Board
Model: MB-102
Dimension (l-w-h) in mm: 170-55-10
Tie points: 830
Weight: 85 grams
Temperature range: -20 ~ +80°C
Contact resistance: 100 mΩ max.
Insulation resistance: 1000MΩ min.
Dielectric withstanding voltage: 500V AC per 1 minute.